TADHE U901 Polyimide (PI) Bonding UV Adhesive

TADHE®

U901 Polyimide (PI) Bonding

UV Adhesive

Product Introduction

(PI) POLYIMIDE BONDING UV ADHESIVE

Shenzhen TADHE Materials Co., Ltd.

SHENZHEN TADHE MATERIALS CO.,LTD

Official Website: www.taidake.com

U901 PI POLYIMIDE BONDING UV ADHESIVE

(PI) POLYIMIDE BONDING UV ADHESIVE

1.1 Product Overview

U901 is a polyimide (PI) bonding UV adhesive of the TADHE® brand, developed with modified acrylic UV resin for difficult-to-bond plastic substrates such as PI (polyimide) and PA (polyamide). It is a colorless transparent liquid, color-customizable on request, and cures rapidly under UV light with a wavelength not greater than 395 nm.

1.2 Product Positioning

U901 is mainly applied in electronic processing scenarios such as bonding PI, CPI and PA plastics, FPC (flexible printed circuit) reinforcement, and chip waterproof sealing protection. It provides strong, flexible and bend-resistant reliable solutions for the pain points of polyimide substrates such as difficult adhesion, easy peeling, and easy cracking when bent.

·Strong adhesion: excellent peel resistance, reliable bonding performance even at a bonding area of 3mm² for glass-to-metal.

·Tough and impact-resistant: flexible adhesive, repeated bending without cracking or delamination.

·Excellent weatherability: water-resistant, resistant to high and low temperatures, and can pass the double-85 (high temperature & high humidity) reliability test.

·Fast curing & good surface drying: cures quickly upon UV irradiation with a dry surface, shortening production takt time.

·Excellent process adaptability: high viscosity and non-stringing, compatible with manual and automatic dispensing.

·Quality assurance: high transparency, durable aging resistance, solvent-free and eco-friendly, supports custom-colored adhesive for easy quality inspection.

U901 is widely used in electronic processing and component protection fields. Typical applications include:

·PI film chip protection: waterproof sealing protection for chips and surrounding circuits on FPC.

·FPC reinforcement: reinforcement at bending areas of flexible circuit boards and flat-cable connection points.

·Wire terminal reinforcement: bonding reinforcement for wire terminals, flat-cable solder joints and similar areas.

·PA material bonding: reliable bonding between PA plastic parts and transparent materials or filamentary structures.

·Chip waterproof sealing protection: provides insulation, waterproof and moisture-proof sealing protection for sensitive components.

5.1 Recommended UV Curing Lamps

·400W UV lamp (11 mW/cm²);

·20W UV flashlight with wavelength not greater than 395 nm;

·or other UV lamps that can meet the curing requirements.

5.2 Operation Steps

·1. Clean the bonding surfaces thoroughly, then slowly apply the adhesive, being careful to avoid air bubbles;

·2. Cure by irradiating with the UV lamp at a distance of about 10–30 cm for about 15 seconds (adjust according to the UV lamp actually used);

·3. If the adhesive layer is thicker, appropriately increase the UV irradiation intensity or time;

·4. Store unused adhesive in a sealed container at room temperature, away from light.

5.3 Precautions

Each cured resin layer must be less than 1 mm thick; for thicker layers, cure in multiple passes to ensure complete curing.

U901 is available in multiple packaging specifications to suit different usage needs:

·30g syringe;

·50g syringe;

·1000g bottle.

·Storage conditions: keep sealed, at room temperature, away from light.

·Unused adhesive should be kept sealed at room temperature away from light, avoiding UV irradiation.

·Use within the validity period marked on the package; the shelf life is generally 10 months.

Shenzhen TADHE Materials Co., Ltd.

SHENZHEN TADHE MATERIALS CO.,LTD

Official Website: www.taidake.com